PCB Gbugbɔgawɔ Kple Dzadzraɖo Ŋuti Mɔfiame [pdf].

PCB gbugbɔgawɔ kple edzadzraɖo nye ɖoɖo si wowɔna tsɔ ɖɔa nusiwo gblẽ ɖo, ɖɔlia akpa aɖewo, alo trɔa asi le nutome sue ƒe ʋuƒo siwo wota ŋu le wo wɔwɔ zi gbãtɔ megbe be woagawɔ dɔ bliboe. Eɖanye xɔtuɖaŋunyala si le kuxiwo gbɔ kpɔm na kpɔɖeŋu si do kpo nu alo nuwɔwɔ dzikpɔla si le nyonyome dzi kpɔkpɔ dzi kpɔm le agbɔsɔsɔ me o, PCB gbugbɔgawɔ ƒe mɔnuwo bibi le vevie ŋutɔ na gbeɖuɖɔ dzi ɖeɖe kpɔtɔ, gazazãwo dzi ɖeɖe kpɔtɔ, kple ɣeyiɣi si woatsɔ ayi asi me kabakaba.

Nukae Nye Mɔnu Vevi Siwo Le megbe na PCB Gbugbɔgawɔ Nyuie?

PCB gbugbɔgawɔ lɔ dzoxɔxɔ kple mɔ̃ɖaŋununya ƒe dɔwɔwɔ vovovo siwo dzi wokpɔna siwo wowɔ be woaɖe akpa aɖewo ɖa, aɖɔli wo, alo atrɔ asi le wo ŋu evɔ womagblẽ nu le ʋuƒo si ƒo xlãe ŋu o. Le eƒe gɔmeɖoanyi me la, gbugbɔgawɔ nyuie nɔ te ɖe gɔmeɖose etɔ̃ siwo do ƒome kple wo nɔewo dzi: dzoxɔxɔ zazã pɛpɛpɛ, nusiwo wotsɔ wɔe ƒe sɔsɔ, kple dɔwɔwɔ ƒe gbugbɔgawɔ.

Gbugbɔgawɔdɔ siwo bɔ wu dometɔ aɖewoe nye solder reflow na BGA (Ball Grid Array) reballing, akpa aɖewo ɖeɖe ɖa to ya dzodzoe gbugbɔgawɔ teƒewo, trace repair to conductive epoxy alo jumper wires zazã me, kple conformal coating ɖeɖeɖa kple gbugbɔgade. Mɔnu ɖesiaɖe bia be woase board la ƒe dzoxɔxɔ ƒe nɔnɔme gɔme nyuie — vevietɔ eƒe glass transition temperature (Tg) kple dzoxɔxɔ ƒe seselelãme si le akpa siwo te ɖe eŋu me.

Egbegbe rework stations zãa infrared alo convective dzoxɔxɔ si ŋu programmable profiles le tsɔ ɖea reflow oven ƒe nɔnɔme gbãtɔwo fiana nyuie alesi woate ŋui. Tete ɖa tso nɔnɔmetata siawo gbɔe nye nu vevitɔ si hea kpododonu siwo gbugbɔgawɔ hena vɛ vɛ, siwo dometɔ aɖewoe nye ƒunukpeƒe siwo fa miamiamia, akɔtaɖonu siwo wodo ɖe dzi, kple delamination.

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Key Insight: PCB gbugbɔgawɔ si xɔ asi wue nye esi ƒomevi wòle be nàwɔ zi eve. Gadede dzoxɔxɔ ƒe nɔnɔmetatawo wɔwɔ ƒe dɔwɔnu nyuiwo kple dɔwɔlawo ƒe hehenana me xea viɖe siwo wu ga si wogblẽ do ŋgɔ sã — dɔwɔƒea ƒe nyatakakawo ɖenɛ fiana ɣesiaɣi be gbugbɔgawɔ ƒe gazazãwo dzina ɖe edzi zi gbɔ zi 10 le afɔɖeɖe ɖesiaɖe si yi ŋgɔ wu gbãtɔ ƒe wɔwɔme.

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Dɔwɔnuwo Kple Nusiwo Nàhiã Na PCB Dzadzraɖo?

PCB dzadzraɖo dzidzedzetɔe dzea egɔme tso dɔwɔnu nyuitɔwo ƒe amesinɔnɔ dzi. Dɔwɔnu siwo ŋu ŋusẽ mele o alo esiwo mewɔa dɔ pɛpɛpɛ o gbɔe nu evelia siwo gblẽna le wo ŋu ƒe akpa gã aɖe tsona le wo gbugbɔgawɔ me. Dɔwɔnu vevi si woatsɔ awɔ PCB gbugbɔgawɔ kple edzadzraɖo le dɔnyala ƒe dzeside me enye si:

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• Ya Dzodzoe Gbugbɔgawɔ Dɔwɔƒe: Dɔwɔƒe si woate ŋu awɔ ɖoɖo ɖe eŋu si me nozzle siwo woate ŋu atrɔ hena SMD ɖeɖeɖa kple BGA dɔwɔwɔ. Di ya ƒe sisi dzi kpɔkpɔ le 0–120 L/min kple dzoxɔxɔ ƒe nyateƒetoto si nye ±1°C dome.
• Soldering Iron with Fine Tips: Ehiã na do ƒe akpa si to do me ɖɔliɖɔli, ka ƒe babla, kple trace dzadzraɖo. Ga si wokpɔa dzoxɔxɔ dzi le 250–380°C ƒe domedome nye nusi wozãna ɖaa.
• Flux kple Solder Paste: Wolɔ̃a flux si mekɔ o le egbegbe nɔnɔme akpa gãtɔ me. Zã solder paste si sɔ kple wò alloy ƒe nɔnɔme (SAC305 na lead-free, Sn63/Pb37 na leaded boards).
• PCB Preheater alo Infrared Bottom Heater: Eɖea dzoxɔxɔ ƒe ʋuʋu dzi kpɔtɔna eye wòxea mɔ na warping to dzoxɔxɔ ɖekawɔwɔ na board la tso ete le akpa aɖewo ɖeɖeɖa me.
• Nusuekpɔmɔ̃ kple Dzodzro ƒe Dɔwɔɖoɖo: Stereo nusuekpɔmɔ̃ (ne mede ɖeke o la, 10x ƒe dzidziɖedzi) eye le nɔnɔme nyuitɔ me la, enye dɔwɔnu si wotsɔna léa ŋku ɖe nu ŋu le eɖokui si (AOI) hena kpeɖodzinana le dɔwɔwɔ ake megbe.
• Desoldering Pump and Wick: Mɔ̃ kple capillary solder ɖeɖeɖa dɔwɔnuwo hena viawo kɔklɔ, pads kɔklɔ, kple anyigbawo dzadzraɖo hena akpa aɖewo ɖɔliɖɔli.
• Conformal Coating Pen and Stripper: Ehiã na board siwo wɔa dɔ le nɔnɔme sesẽwo me afisi wòle be woaɖe nutsyɔnu ɖa le teƒea eye woagade edzi le dɔwɔwɔ ake megbe.

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Aleke Nàwɔ Akpɔ Xexeame Katã ƒe BGA kple SMD Gbugbɔgawɔ ƒe Kuxiwo Gbɔe?

Wobua BGA gbugbɔgawɔ be enye PCB dzadzraɖodɔ si bia nu geɖe wu le solder joint geometry ɣaɣla kple interconnects ƒe density gã ta. BGA gbugbɔgawɔ ƒe ɖoɖo si wozãna ɖaa la lɔ akpa ene ɖe eme: akpa ene ɖeɖeɖa, teƒea dzadzraɖo, solder ball deposition (reballing), kple controlled reflow.

Le teƒea dzadzraɖo me la, ele be woaɖe solder susɔeawo katã ɖa le pads la ŋu to braid kple flux zazã me, eye emegbe woatsɔ isopropyl alcohol (IPA) alo flux remover tɔxɛ aɖe akɔ wo ŋu. Emegbe wodzidzea pad coplanarity — pad ƒe kɔkɔme ƒe tɔtrɔ ɖesiaɖe si wu micron 50 ateŋu agblẽ nu le ƒunukpeƒe ƒe kakaɖedzi ŋu le tsi si wogbugbɔ sisi vɔ megbe.

Le SMD ƒe akpawo gome la, dɔwɔwɔa le tẽ wu gake ebia be woalé ŋku ɖe pad ƒe nɔnɔme kple solderability ŋu sɔsɔe. Pad siwo me oxidized alo contaminated nye nu vevitɔ si hea ʋuʋu siwo me tsi mele o vɛ le wo gbugbɔgawɔ megbe. Mɔ̃ɖaŋununya ƒe ʋuʋu bɔbɔe kple fiberglass pen si kplɔe ɖo kple flux zazã nana solder ƒe tsidzadza kple ƒunukpeƒe ƒe nyonyome nyona ɖe edzi ŋutɔ.

Nudzɔdzɔwo ŋuti numekuku siwo tso nubablawɔlawo gbɔ ɖee fia ɣesiaɣi be dɔwɔlawo ƒe hehenana kple dɔwɔwɔ ŋuti mɔfiame siwo woɖo ɖe ɖoɖo nu ɖea dɔwɔwɔ ake ƒe gege ɖe anyi ƒe agbɔsɔsɔ dzi kpɔtɔna 40–60% ne wotsɔe sɔ kple mɔnu siwo wozãna le ɣeyiɣi aɖe koŋ me. Nuŋlɔɖi wɔwɔ ɖe dɔ ɖesiaɖe si wogbugbɔ wɔ ŋu — si me dzoxɔxɔ ƒe nɔnɔmetata siwo wozã, akpa siwo woɖɔli, kple ŋkuléleɖenuŋu me tsonu hã le — wɔa nyonyome ŋuti nuŋlɔɖi si woate ŋu akpɔ si le vevie na dɔwɔƒe siwo ŋu wowɔ ɖoɖo ɖo abe yamenutomeyimɔ̃wo, atikewɔnuwo, kple ʋuwo ƒe elektrɔnikmɔ̃wo ene.

Aleke PCB Gbugbɔgawɔ Ne wotsɔe sɔ kple Board Blibo Ðɔɖɔɖo?

Nyametsotso be woagawɔ dɔ ake tsɔ wu be woaɖɔli PCB nye ganyawo kple afɔkuwo me dzodzro le gɔmedzedzea me. Zi geɖe la, wolɔ̃a gbugbɔgawɔ ne akpa aɖewo ƒe gazazãwo sɔ gbɔ, ɣeyiɣi siwo woatsɔ awɔ dɔe didi, alo mɔ̃ɖaŋununya ƒe ɣeyiɣi vevi aɖe le board la ƒe wɔwɔme me. Board bliboa ɖɔliɖɔli va nyona wu ne nusiwo gblẽ le eŋu lolo, board la mexɔ asi o, alo afɔku siwo le dɔwɔwɔ ake me gblẽ dɔwɔwɔ ƒe kakaɖedzi me.

Le prototype kple low-volume production nɔnɔmewo me la, ɣesiaɣi kloe la, gbugbɔgawɔ xɔa ga geɖe wu. Le adzɔnuwo wɔwɔ si ƒe lolome lolo me la, akɔntabubua trɔna — nuwo me dzodzro le wo ɖokui si kple nusiwo gblẽ ƒe agbɔsɔsɔme si dzi wokpɔna ate ŋu ana nuwo ɖɔliɖɔli nanyo wu le ganyawo gome ne dɔwɔɖui ƒe gazazã siwo wogbugbɔ wɔ la wu gazazã siwo wogblẽna le nu gbagbãwo ŋu le agbɔsɔsɔ me.

| Zi geɖe la, IPC ƒe dzidzenuwo dzi wɔwɔ nyea nubabla ƒe nudidi na aʋawɔnuwo kple yamenutomeyimɔ̃wo ƒe nudzralawo.

Nukae Nye PCB Dzadzraɖo Vodada Siwo Bɔ Wu Kple Aleke Nàwɔ Aƒo Asa Na Wo?

Mɔ̃ɖaŋudɔwɔla bibiwo gɔ̃ hã doa go mɔ̃wo le PCB gbugbɔgawɔ me. Vodada siwo dzɔna zi geɖe enye dzoxɔxɔ ƒe ɣeyiɣi si gbɔ eme zazã (si hea pad delamination vɛ), flux chemistry si mesɔ o zazã (gblẽa nusiwo gblẽna ɖi), dzodzo do ŋgɔ ƒe tsatsam (si hea dzoxɔxɔ ƒe ʋuʋu vɛ), kple kpododonu le solder joint ƒe nyonyome me toto kple X-ray inspection le BGA reballing megbe.

| Habɔbɔ siwo kpɔa xɔtunuwo ƒe dɔwɔwɔ sesẽwo dzi kpɔa viɖe geɖe tso dɔwɔwɔ siawo ƒe ɖoɖowɔwɔ ɖe teƒe ɖeka le asitsatsa dzikpɔkpɔ ƒe ɖoɖo ɖeka me afisi woléa ŋku ɖe nuŋlɔɖiwo, dɔdasiwo, kple nuŋlɔɖi nyuiwo ŋu le le teƒe ɖeka.

Nyabiase Siwo Wobiana Enuenu

Vovototo kae le PCB gbugbɔgawɔ kple PCB dzadzraɖo dome?

PCB gbugbɔgawɔ fia ɖɔɖɔɖo alo asitɔtrɔ le board si meto ŋkuléle ɖe eŋu me haɖe o — zi geɖe la, wowɔa esia le ewɔwɔ alo eƒe kpɔɖeŋuwɔwɔ me. PCB dzadzraɖo fia be woagbugbɔ dɔwɔwɔ aɖo board si nɔ dɔ wɔm xoxo eye wòdo kpo nu. Wo ame evea siaa zãa mɔnu siwo sɔ gake woto vovo le woƒe lolome, nuŋlɔɖi ƒe nudidiwo, kple nyonyome ƒe dzidzenu siwo wozã me.

Ðe woate ŋu agbugbɔ awɔ dɔ tso PCB siwo wotsɔ conformal-coated ŋua?

Ẽ, woate ŋu agbugbɔ awɔ dɔ le ʋuƒo siwo ŋu wofa nu ɖo le mɔ si sɔ nu, gake ele be woaɖe nusi wotsɔ blae la ɖa le teƒea gbã to atike siwo ɖea nu, micro abrasion, alo dzoxɔxɔmɔnu siwo sɔ ɖe nusi wotsɔ blae ƒe ƒomevi nu (acrylic, urethane, silicone, alo epoxy) zazã me. Ne wogawɔ dɔ ake vɔ la, ele be woakɔ teƒea ŋu, alé ŋku ɖe eŋu, eye woagbugbɔ atsyɔ edzi abe alesi wogblɔe gbã ene be woalé nutome takpɔkpɔ me ɖe asi.

Aleke mawɔ anya ne PCB megale dzadzraɖo o?

Zi geɖe la, wobua board be mate ŋu adzrae ɖo o ne eɖe nusiwo gblẽ le ƒuƒoƒo geɖe ƒe trace ŋu si keke ta, delamination sesẽ le ƒuƒoƒo geɖewo me, BGA pad cratering kple inner layer disconnects, alo ne ga kple afɔku si le gbugbɔgawɔ me wu board la ƒe asixɔxɔ. Wozãa X-ray me dzodzro, cross-section analysis, kple elektrik dodokpɔ tsɔ wɔa nyametsotso sia pɛpɛpɛ.

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Hardware dɔwɔwɔwo dzikpɔkpɔ, dɔwɔwɔ ƒe ɖoɖo nyuiwo, nuŋlɔɖiwo, kple ƒuƒoƒo ƒe ɖoɖowɔwɔ le PCB wɔwɔ alo edzadzraɖo ƒe dɔwɔƒe katã bia nu geɖe wu mɔ̃ɖaŋu ŋuti nunya ko — ebia mɔnu si wotu na dɔwɔwɔ ƒe lolome. Mewayz nye asitsadɔwɔɖoɖo si me mɔ̃ 207 le si dɔwɔla siwo wu 138,000 zãna tsɔ kpɔa woƒe asitsatsa ƒe akpa ɖesiaɖe dzi, tso dɔa ƒe dɔwɔwɔ ƒe ɖoɖowo kple ƒuƒoƒo ƒe nuwɔwɔ aduadu dzi va ɖo CRM kple numekuku dzi — wodzea egɔme tso $19/ɣleti ko dzi.

Èle klalo be yeahe ɖoɖo kple dɔwɔwɔ nyuie ava wò dɔwɔnawo mea? Dze wò Mewayz mɔzɔzɔ gɔme egbea le app.mewayz.com eye nàke ɖe alesi asitsatsa ƒe OS blibo trɔa alesi nèwɔa dɔe ŋu.